• No Clean Reflow
• Lead free Wave Soldering
• Double Side Reflow
• Conformal Coating
• OSP Coating Soldering
• 0201 Chip
• 20mil QFP, 50 mil BGA
• 0.75mm CSP
• 0.5mm CSP
• 16mil DFP
• TRI 5001 Application
• ICT Programming
• ICT Fixture Fabrication
• Prototype Engineering
• Professional product function test
• Online AOI
• BGA reworking
• 2D X-ray
• Press fit
• Lead free Technology
• FPC Assembly
• PCBA level traceability
|
• Component Engineering
• 1mm, 2000+ I/O BGA
• 0.4 mm CSP
• AXI
• Real Time Line Monitor
• Thermal cycle
• Manual DFM
• Glue printing
• Anti-wrong part system
• Component traceability system |
